BGAH310-075E
Ohmite
Ohmite
BGA HEATSINK W/TAPE
$6.65
Available to order
Reference Price (USD)
1+
$6.65000
500+
$6.5835
1000+
$6.517
1500+
$6.4505
2000+
$6.384
2500+
$6.3175
Exquisite packaging
Discount
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Upgrade your thermal management with Ohmite's BGAH310-075E Heat Sinks, engineered for superior cooling efficiency. Featuring advanced fin designs and high-quality materials, these heat sinks ensure optimal thermal conductivity and longevity. Perfect for use in telecommunications, medical devices, and consumer electronics. Ready to enhance your system's performance? Submit your inquiry now and our team will assist you with the best thermal solutions.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA, CPU, GPU
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Angled Fins
- Length: 1.220" (31.00mm)
- Width: 1.220" (31.00mm)
- Diameter: -
- Fin Height: 0.295" (7.50mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: -
- Thermal Resistance @ Natural: 6.30°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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