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HSS24-B20-NP

CUI Devices
HSS24-B20-NP Preview
CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
$0.98
Available to order
Reference Price (USD)
1+
$0.98000
500+
$0.9702
1000+
$0.9604
1500+
$0.9506
2000+
$0.9408
2500+
$0.931
Exquisite packaging
Discount
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Specifications

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Bolt On
  • Shape: Rectangular, Fins
  • Length: 1.654" (42.00mm)
  • Width: 1.496" (38.00mm)
  • Diameter: -
  • Fin Height: 0.984" (25.00mm)
  • Power Dissipation @ Temperature Rise: 7.85W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 4.30°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 9.56°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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