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XR2C-3200-HSG

Omron Electronics Inc-EMC Div
XR2C-3200-HSG Preview
Omron Electronics Inc-EMC Div
CONN IC SOCKET 32POS
$0.00
Available to order
Reference Price (USD)
1,000+
$0.21861
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: Housing
  • Number of Positions or Pins (Grid): 32 (1 x 32)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: -
  • Contact Finish Thickness - Mating: -
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Closed Frame
  • Termination: Wire Wrap
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: -
  • Contact Finish Thickness - Post: -
  • Contact Material - Post: Beryllium Copper
  • Housing Material: Polybutylene Terephthalate (PBT), Glass Filled
  • Operating Temperature: -55°C ~ 125°C

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