X66AK2H06AAW2

Texas Instruments

Manufacturer

Texas Instruments

Description:

IC DSP ARM SOC BGA

Datasheet:

X66AK2H06AAW2 Datasheet

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Experience next-generation signal processing with Texas Instruments's X66AK2H06AAW2 DSP, built for embedded applications that demand reliability and speed. Features include scalable architecture, low power usage, and comprehensive development tools. Ideal for use in renewable energy systems, smart appliances, and military applications. Choose Texas Instruments for cutting-edge technology. Send us your requirements for a tailored solution.

Specifications

Product Status: Discontinued at Digi-Key
Type: DSP+ARM®
Interface: EBI/EMI, Ethernet, DMA, I²C, Serial RapidIO, SPI, UART/USART, USB 3.0
Clock Rate: 1.2GHz
Non-Volatile Memory: ROM (384kB)
On-Chip RAM: 8.375MB
Voltage - I/O: 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V
Voltage - Core: Variable
Operating Temperature: 0°C ~ 85°C (TC)
Mounting Type: Surface Mount
Package / Case: 1517-BBGA, FCBGA
Supplier Device Package: 1517-FCBGA (40x40)