UPD60802AF1-A10-BND-E2-A
Renesas Electronics America Inc
Renesas Electronics America Inc
SOC MEDIA IC
$10.92
Available to order
Reference Price (USD)
1+
$10.92000
500+
$10.8108
1000+
$10.7016
1500+
$10.5924
2000+
$10.4832
2500+
$10.374
Exquisite packaging
Discount
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The UPD60802AF1-A10-BND-E2-A System on Chip from Renesas Electronics America Inc represents the future of embedded computing, combining unparalleled integration with exceptional performance. This advanced SoC solution integrates CPU, GPU, DSP, and various peripherals to create complete systems on a single chip. Key features include high-speed interfaces, hardware acceleration blocks, and advanced power management suitable for demanding applications from robotics to 5G infrastructure. The UPD60802AF1-A10-BND-E2-A reduces development time and system costs while providing the flexibility needed for custom implementations. Renesas Electronics America Inc's comprehensive software suite and reference designs ensure quick time-to-market for your innovative products. Interested in learning how the UPD60802AF1-A10-BND-E2-A can transform your embedded projects? Submit your inquiry now for detailed specifications and volume pricing.
Specifications
- Product Status: Active
- Architecture: -
- Core Processor: -
- Flash Size: -
- RAM Size: -
- Peripherals: -
- Connectivity: -
- Speed: -
- Primary Attributes: -
- Operating Temperature: -
- Package / Case: -
- Supplier Device Package: -
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