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TS391SNL250

Chip Quik Inc.
TS391SNL250 Preview
Chip Quik Inc.
THERMALLY STABLE SOLDER PASTE NO
$69.95
Available to order
Reference Price (USD)
1+
$69.95000
Exquisite packaging
Discount
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Specifications

  • Product Status: Active
  • Type: Solder Paste
  • Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Diameter: -
  • Melting Point: 423 ~ 428°F (217 ~ 220°C)
  • Flux Type: No-Clean
  • Wire Gauge: -
  • Mesh Type: 4
  • Process: Lead Free
  • Form: Jar, 8.8 oz (250g)
  • Shelf Life: 12 Months
  • Shelf Life Start: Date of Manufacture
  • Storage/Refrigeration Temperature: 68°F ~ 77°F (20°C ~ 25°C)

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