TH997-288-192-1.0
Penchem Technologies Sdn Bhd
Penchem Technologies Sdn Bhd
SOFT SILICONE THERMAL PAD
$13.50
Available to order
Reference Price (USD)
1+
$13.50000
500+
$13.365
1000+
$13.23
1500+
$13.095
2000+
$12.96
2500+
$12.825
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Penchem Technologies Sdn Bhd's TH997-288-192-1.0 Thermal Pads and Sheets offer unmatched thermal management for a wide range of electronic devices. With superior heat dissipation properties, these pads and sheets are ideal for use in data centers, medical equipment, and other high-performance applications. Trust in Penchem Technologies Sdn Bhd's expertise to deliver products that meet your cooling needs. Submit your inquiry now and let us help you find the perfect solution.
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.0394" (1.000mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Blue
- Thermal Resistivity: -
- Thermal Conductivity: 2.4W/m-K
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