TG994-288-192-1.0
t-Global Technology
t-Global Technology
HIGH PERFORMANCE SILICONE GAP FI
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t-Global Technology's TG994-288-192-1.0 Thermal Pads and Sheets offer unmatched thermal management for a wide range of electronic devices. With superior heat dissipation properties, these pads and sheets are ideal for use in data centers, medical equipment, and other high-performance applications. Trust in t-Global Technology's expertise to deliver products that meet your cooling needs. Submit your inquiry now and let us help you find the perfect solution.
Specifications
- Product Status: Obsolete
- Usage: -
- Type: Conductive Pad, Sheet
- Shape: Rectangular
- Outline: 288.00mm x 192.00mm
- Thickness: 0.0394" (1.000mm)
- Material: Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 13W/m-K
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