M2S090-FG676
Microchip Technology
Microchip Technology
IC SOC CORTEX-M3 166MHZ 676FBGA
$233.48
Available to order
Reference Price (USD)
40+
$157.47200
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Upgrade your embedded systems with Microchip Technology's M2S090-FG676 System on Chip (SoC), the ultimate all-in-one computing solution. These innovative chips pack processors, memory, and I/O into a compact package, reducing system complexity and BOM costs. The M2S090-FG676 stands out with its scalable performance, real-time processing capabilities, and support for multiple operating systems. Whether you're developing automotive systems, medical devices, or AI-powered edge computing solutions, this SoC delivers the perfect balance of power and efficiency. Benefit from Microchip Technology's proven reliability and extensive ecosystem of development tools and software support. Take your embedded designs to the next level - request a quote for the M2S090-FG676 SoC now and let our experts guide you through implementation.
Specifications
- Product Status: Active
- Architecture: MCU, FPGA
- Core Processor: ARM® Cortex®-M3
- Flash Size: 512KB
- RAM Size: 64KB
- Peripherals: DDR, PCIe, SERDES
- Connectivity: CANbus, Ethernet, I²C, SPI, UART/USART, USB
- Speed: 166MHz
- Primary Attributes: FPGA - 90K Logic Modules
- Operating Temperature: 0°C ~ 85°C (TJ)
- Package / Case: 676-BGA
- Supplier Device Package: 676-FBGA (27x27)
Related Products
Renesas Electronics America Inc
UPD63712CGC-8EU-A
AMD Xilinx
XC7Z010-3CLG225E
AMD Xilinx
XCZU19EG-1FFVC1760I
Renesas Electronics America Inc
UPD9937F1-CAL-A
AMD Xilinx
XCZU17EG-3FFVD1760E
AMD Xilinx
XCZU17EG-1FFVC1760E
Infineon Technologies
PSB2168HV4.1
AMD Xilinx
XCZU11EG-1FFVC1760E
Renesas Electronics America Inc
UPD60803F1-A11-BND-E2-A
AMD Xilinx