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IC-316-SGG

Samtec Inc.
IC-316-SGG Preview
Samtec Inc.
CONN IC DIP SOCKET 16POS GOLD
$0.00
Available to order
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Specifications

  • Product Status: Obsolete
  • Type: DIP, 0.3" (7.62mm) Row Spacing
  • Number of Positions or Pins (Grid): 16 (2 x 8)
  • Pitch - Mating: 0.100" (2.54mm)
  • Contact Finish - Mating: Gold
  • Contact Finish Thickness - Mating: 30.0µin (0.76µm)
  • Contact Material - Mating: Beryllium Copper
  • Mounting Type: Through Hole
  • Features: Open Frame
  • Termination: Solder
  • Pitch - Post: 0.100" (2.54mm)
  • Contact Finish - Post: Gold
  • Contact Finish Thickness - Post: 30.0µin (0.76µm)
  • Contact Material - Post: Phosphor Bronze
  • Housing Material: Polyester, Glass Filled
  • Operating Temperature: -55°C ~ 125°C

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