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HSS25-B20-P51

CUI Devices
HSS25-B20-P51 Preview
CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
$0.73
Available to order
Reference Price (USD)
1+
$0.72963
500+
$0.7223337
1000+
$0.7150374
1500+
$0.7077411
2000+
$0.7004448
2500+
$0.6931485
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: Board Level
  • Package Cooled: TO-218, TO-220
  • Attachment Method: PC Pin
  • Shape: Square, Fins
  • Length: 1.000" (25.40mm)
  • Width: 1.000" (25.40mm)
  • Diameter: -
  • Fin Height: 1.673" (42.50mm)
  • Power Dissipation @ Temperature Rise: 5.88W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 6.30°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 12.75°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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