HSS23-B20-NP
CUI Devices
CUI Devices
HEAT SINK, STAMPING, TO-218/TO-2
$0.78
Available to order
Reference Price (USD)
1+
$0.78000
500+
$0.7722
1000+
$0.7644
1500+
$0.7566
2000+
$0.7488
2500+
$0.741
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
CUI Devices's HSS23-B20-NP Heat Sinks offer cutting-edge thermal solutions for modern technology. With exceptional heat transfer capabilities and rugged durability, they are perfect for industrial machinery, defense systems, and consumer gadgets. Elevate your cooling strategy contact us now for personalized recommendations and competitive pricing.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: TO-218, TO-220
- Attachment Method: Bolt On
- Shape: Rectangular, Fins
- Length: 1.654" (42.00mm)
- Width: 1.496" (38.00mm)
- Diameter: -
- Fin Height: 0.787" (20.00mm)
- Power Dissipation @ Temperature Rise: 7.36W @ 75°C
- Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 10.19°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
Related Products
Advanced Thermal Solutions Inc.
ATS-01D-51-C3-R0
Advanced Thermal Solutions Inc.
ATS-05H-204-C3-R0
Advanced Thermal Solutions Inc.
ATS-10H-15-C2-R0
Advanced Thermal Solutions Inc.
ATS-19A-63-C2-R0
Advanced Thermal Solutions Inc.
ATS-16H-151-C1-R0
Advanced Thermal Solutions Inc.
ATS-09B-33-C2-R0
Advanced Thermal Solutions Inc.
ATS-18D-168-C3-R0
Advanced Thermal Solutions Inc.
ATS-04C-09-C2-R0
Advanced Thermal Solutions Inc.
ATS-12G-174-C2-R0
Advanced Thermal Solutions Inc.