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HSS13-B20-NP

CUI Devices
HSS13-B20-NP Preview
CUI Devices
HEAT SINK, STAMPING, TO-220, 31
$1.12
Available to order
Reference Price (USD)
1+
$1.12000
500+
$1.1088
1000+
$1.0976
1500+
$1.0864
2000+
$1.0752
2500+
$1.064
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: Board Level, Vertical
  • Package Cooled: TO-220
  • Attachment Method: -
  • Shape: Rectangular
  • Length: 1.220" (31.00mm)
  • Width: 0.994" (25.25mm)
  • Diameter: -
  • Fin Height: 0.508" (12.90mm)
  • Power Dissipation @ Temperature Rise: 4.8W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 7.70°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 15.50°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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