HSS-B20-061H-01
CUI Devices

CUI Devices
HEATSINK TO-220 2.3W ALUMINUM
$0.34
Available to order
Reference Price (USD)
3,000+
$0.31320
Exquisite packaging
Discount
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CUI Devices's HSS-B20-061H-01 Heat Sinks offer cutting-edge thermal solutions for modern technology. With exceptional heat transfer capabilities and rugged durability, they are perfect for industrial machinery, defense systems, and consumer gadgets. Elevate your cooling strategy contact us now for personalized recommendations and competitive pricing.
Specifications
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-220
- Attachment Method: PC Pin
- Shape: Rectangular, Fins
- Length: 0.500" (12.70mm)
- Width: 0.504" (12.80mm)
- Diameter: -
- Fin Height: 0.590" (15.00mm)
- Power Dissipation @ Temperature Rise: 2.3W @ 75°C
- Thermal Resistance @ Forced Air Flow: 11.04°C/W @ 200 LFM
- Thermal Resistance @ Natural: 33.28°C/W
- Material: Aluminum
- Material Finish: Black Anodized