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HSE10-B20-NP

CUI Devices
HSE10-B20-NP Preview
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
$0.56
Available to order
Reference Price (USD)
1+
$0.56000
500+
$0.5544
1000+
$0.5488
1500+
$0.5432
2000+
$0.5376
2500+
$0.532
Exquisite packaging
Discount
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Specifications

  • Product Status: Active
  • Type: Top Mount
  • Package Cooled: TO-218, TO-220
  • Attachment Method: Bolt On
  • Shape: Rectangular
  • Length: 0.984" (25.00mm)
  • Width: 0.472" (12.00mm)
  • Diameter: -
  • Fin Height: 0.177" (4.50mm)
  • Power Dissipation @ Temperature Rise: 1.95W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 20.90°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 38.45°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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