HSE09-755028
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
$3.45
Available to order
Reference Price (USD)
1+
$3.45000
500+
$3.4155
1000+
$3.381
1500+
$3.3465
2000+
$3.312
2500+
$3.2775
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
CUI Devices's HSE09-755028 Heat Sinks offer cutting-edge thermal solutions for modern technology. With exceptional heat transfer capabilities and rugged durability, they are perfect for industrial machinery, defense systems, and consumer gadgets. Elevate your cooling strategy contact us now for personalized recommendations and competitive pricing.
Specifications
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-218, TO-220
- Attachment Method: Clip
- Shape: Rectangular, Angled Fins
- Length: 2.953" (75.00mm)
- Width: 1.102" (28.00mm)
- Diameter: -
- Fin Height: 1.969" (50.00mm)
- Power Dissipation @ Temperature Rise: 13.26W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 5.66°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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