HSE08-505028
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-218/TO-
$2.46
Available to order
Reference Price (USD)
1+
$2.46000
500+
$2.4354
1000+
$2.4108
1500+
$2.3862
2000+
$2.3616
2500+
$2.337
Exquisite packaging
Discount
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Discover high-performance HSE08-505028 Heat Sinks from CUI Devices, designed to optimize thermal management in various applications. These heat sinks feature excellent heat dissipation, durable construction, and lightweight design, making them ideal for electronics, automotive, and industrial uses. Whether you need cooling solutions for CPUs, power supplies, or LED systems, our heat sinks deliver reliable performance. Contact us today for a quote and let us help you find the perfect thermal solution for your needs.
Specifications
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-218, TO-220
- Attachment Method: Clip
- Shape: Rectangular, Angled Fins
- Length: 1.969" (50.00mm)
- Width: 1.102" (28.00mm)
- Diameter: -
- Fin Height: 1.969" (50.00mm)
- Power Dissipation @ Temperature Rise: 10.53W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.70°C/W @ 200 LFM
- Thermal Resistance @ Natural: 7.13°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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