HSE02-173213P
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
$2.86
Available to order
Reference Price (USD)
1+
$2.86000
500+
$2.8314
1000+
$2.8028
1500+
$2.7742
2000+
$2.7456
2500+
$2.717
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
The HSE02-173213P Heat Sinks by CUI Devices set the standard in thermal management, delivering efficient and quiet operation. Designed with versatility in mind, these heat sinks are ideal for HVAC systems, audio amplifiers, and IoT devices. Need a dependable cooling partner? Send us your inquiry and let our experts guide you to the best thermal solution available.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: -
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Angled Fins
- Length: 0.669" (17.00mm)
- Width: 0.669" (17.00mm)
- Diameter: -
- Fin Height: 0.492" (12.50mm)
- Power Dissipation @ Temperature Rise: 3.5W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.70°C/W @ 200 LFM
- Thermal Resistance @ Natural: 21.44°C/W
- Material: Aluminum Alloy
- Material Finish: Blue Anodized
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