HSE02-173213
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, 17 X 31.9
$1.41
Available to order
Reference Price (USD)
1+
$1.41000
500+
$1.3959
1000+
$1.3818
1500+
$1.3677
2000+
$1.3536
2500+
$1.3395
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Enhance your thermal regulation with HSE02-173213 Heat Sinks from CUI Devices, designed for reliability and efficiency. These heat sinks provide superior cooling for high-density electronics, renewable energy systems, and medical equipment. Let us help you find the right solution reach out today and receive expert support for all your thermal management needs.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: -
- Attachment Method: Thermal Tape, Adhesive (Not Included)
- Shape: Square, Angled Fins
- Length: 0.669" (17.00mm)
- Width: 0.669" (17.00mm)
- Diameter: -
- Fin Height: 0.492" (12.50mm)
- Power Dissipation @ Temperature Rise: 3.5W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.70°C/W @ 200 LFM
- Thermal Resistance @ Natural: 21.44°C/W
- Material: Aluminum Alloy
- Material Finish: Blue Anodized
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