HSE01-193175P
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, 19 X 31.5
$1.90
Available to order
Reference Price (USD)
1+
$1.90000
500+
$1.881
1000+
$1.862
1500+
$1.843
2000+
$1.824
2500+
$1.805
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Keep your systems cool and efficient with CUI Devices's HSE01-193175P Heat Sinks, built for high-performance applications. These heat sinks feature optimized thermal resistance and sleek designs, suitable for robotics, electric vehicles, and telecommunications. Ready to improve your thermal management? Submit your request today and benefit from our industry-leading expertise.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: -
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Angled Fins
- Length: 0.748" (19.00mm)
- Width: 0.748" (19.00mm)
- Diameter: -
- Fin Height: 0.295" (7.50mm)
- Power Dissipation @ Temperature Rise: 2.95W @ 75°C
- Thermal Resistance @ Forced Air Flow: 9.20°C/W @ 200 LFM
- Thermal Resistance @ Natural: 25.44°C/W
- Material: Aluminum Alloy
- Material Finish: Blue Anodized
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