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HSE-B508-045H

CUI Devices
HSE-B508-045H Preview
CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
$1.14
Available to order
Reference Price (USD)
1,800+
$0.93100
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram

Specifications

  • Product Status: Active
  • Type: Board Level, Vertical
  • Package Cooled: TO-220
  • Attachment Method: Bolt On and PC Pin
  • Shape: Rectangular, Angled Fins
  • Length: 2.000" (50.80mm)
  • Width: 1.772" (45.00mm)
  • Diameter: -
  • Fin Height: 0.500" (12.70mm)
  • Power Dissipation @ Temperature Rise: 9.3W @ 75°C
  • Thermal Resistance @ Forced Air Flow: 4.38°C/W @ 200 LFM
  • Thermal Resistance @ Natural: 8.06°C/W
  • Material: Aluminum Alloy
  • Material Finish: Black Anodized

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