HSE-B254-04H
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-220/TO-
$0.67
Available to order
Reference Price (USD)
1+
$0.72000
10+
$0.68800
25+
$0.65360
50+
$0.63640
100+
$0.62780
250+
$0.58480
500+
$0.55040
1,000+
$0.49880
5,000+
$0.48160
Exquisite packaging
Discount
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The HSE-B254-04H Heat Sinks by CUI Devices set the standard in thermal management, delivering efficient and quiet operation. Designed with versatility in mind, these heat sinks are ideal for HVAC systems, audio amplifiers, and IoT devices. Need a dependable cooling partner? Send us your inquiry and let our experts guide you to the best thermal solution available.
Specifications
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-218, TO-220
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Fins
- Length: 1.000" (25.40mm)
- Width: 0.650" (16.50mm)
- Diameter: -
- Fin Height: 0.630" (16.00mm)
- Power Dissipation @ Temperature Rise: 4.7W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.93°C/W @ 200 LFM
- Thermal Resistance @ Natural: 15.96°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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