HSE-B20250-045H
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-220, 50
$1.11
Available to order
Reference Price (USD)
1+
$0.87000
10+
$0.82800
25+
$0.78680
50+
$0.76600
100+
$0.75560
250+
$0.70380
500+
$0.66240
1,000+
$0.60030
5,000+
$0.57960
Exquisite packaging
Discount
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Trust CUI Devices's HSE-B20250-045H Heat Sinks for superior thermal performance in any application. Featuring innovative designs and premium materials, these heat sinks are ideal for automotive, aerospace, and computing industries. Don t compromise on cooling efficiency get in touch with us now and explore our range of high-quality thermal solutions.
Specifications
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Fins
- Length: 1.969" (50.00mm)
- Width: 1.181" (30.00mm)
- Diameter: -
- Fin Height: 0.472" (12.00mm)
- Power Dissipation @ Temperature Rise: 7.7W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.05°C/W @ 200 LFM
- Thermal Resistance @ Natural: 9.74°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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