HSE-B20250-040H-01
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
$0.79
Available to order
Reference Price (USD)
1+
$0.58000
10+
$0.55000
25+
$0.52240
50+
$0.50880
100+
$0.50190
250+
$0.46752
500+
$0.44000
1,000+
$0.39875
5,000+
$0.38500
Exquisite packaging
Discount
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The HSE-B20250-040H-01 Heat Sinks by CUI Devices set the standard in thermal management, delivering efficient and quiet operation. Designed with versatility in mind, these heat sinks are ideal for HVAC systems, audio amplifiers, and IoT devices. Need a dependable cooling partner? Send us your inquiry and let our experts guide you to the best thermal solution available.
Specifications
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-220
- Attachment Method: PC Pin
- Shape: Rectangular, Angled Fins
- Length: 0.984" (25.00mm)
- Width: 1.359" (34.50mm)
- Diameter: -
- Fin Height: 0.492" (12.50mm)
- Power Dissipation @ Temperature Rise: 5.5W @ 75°C
- Thermal Resistance @ Forced Air Flow: 4.44°C/W @ 200 LFM
- Thermal Resistance @ Natural: 13.64°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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