HSE-B18635-035H
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION,TO-218, 63.
$1.40
Available to order
Reference Price (USD)
1,200+
$1.15780
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Enhance your thermal regulation with HSE-B18635-035H Heat Sinks from CUI Devices, designed for reliability and efficiency. These heat sinks provide superior cooling for high-density electronics, renewable energy systems, and medical equipment. Let us help you find the right solution reach out today and receive expert support for all your thermal management needs.
Specifications
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-218
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Angled Fins
- Length: 2.500" (63.50mm)
- Width: 1.638" (41.60mm)
- Diameter: -
- Fin Height: 0.984" (25.00mm)
- Power Dissipation @ Temperature Rise: 16.7W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.24°C/W @ 200 LFM
- Thermal Resistance @ Natural: 4.49°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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