HSE-B18508-060H-W
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION,TO-218, 50.
$1.63
Available to order
Reference Price (USD)
1,350+
$1.05840
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Upgrade your thermal management with CUI Devices's HSE-B18508-060H-W Heat Sinks, engineered for superior cooling efficiency. Featuring advanced fin designs and high-quality materials, these heat sinks ensure optimal thermal conductivity and longevity. Perfect for use in telecommunications, medical devices, and consumer electronics. Ready to enhance your system's performance? Submit your inquiry now and our team will assist you with the best thermal solutions.
Specifications
- Product Status: Active
- Type: Board Level, Vertical
- Package Cooled: TO-218
- Attachment Method: Bolt On and PC Pin
- Shape: Rectangular, Angled Fins
- Length: 2.000" (50.80mm)
- Width: 1.638" (41.60mm)
- Diameter: -
- Fin Height: 0.984" (25.00mm)
- Power Dissipation @ Temperature Rise: 12.8W @ 75°C
- Thermal Resistance @ Forced Air Flow: 2.98°C/W @ 200 LFM
- Thermal Resistance @ Natural: 5.86°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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