HSE-B1711-057
CUI Devices
CUI Devices
HEAT SINK, EXTRUSION, TO-220, 25
$0.38
Available to order
Reference Price (USD)
2,500+
$0.27550
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Trust CUI Devices's HSE-B1711-057 Heat Sinks for superior thermal performance in any application. Featuring innovative designs and premium materials, these heat sinks are ideal for automotive, aerospace, and computing industries. Don t compromise on cooling efficiency get in touch with us now and explore our range of high-quality thermal solutions.
Specifications
- Product Status: Active
- Type: Board Level
- Package Cooled: TO-220
- Attachment Method: Bolt On
- Shape: Rectangular, Fins
- Length: 0.984" (25.00mm)
- Width: 0.625" (16.00mm)
- Diameter: -
- Fin Height: 0.354" (9.00mm)
- Power Dissipation @ Temperature Rise: 3.1W @ 75°C
- Thermal Resistance @ Forced Air Flow: 7.07°C/W @ 200 LFM
- Thermal Resistance @ Natural: 24.19°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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