HSB24-252510
CUI Devices
CUI Devices
HEAT SINK, BGA,25 X 25 X 10 MM
$0.81
Available to order
Reference Price (USD)
1+
$0.81000
500+
$0.8019
1000+
$0.7938
1500+
$0.7857
2000+
$0.7776
2500+
$0.7695
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Experience top-tier cooling with CUI Devices's HSB24-252510 Heat Sinks, crafted for demanding environments. Featuring enhanced surface area and superior airflow, these heat sinks are perfect for data centers, automotive electronics, and power converters. Ensure your equipment runs smoothly contact us today to discuss your requirements and discover the ideal heat sink for your application.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.984" (25.00mm)
- Width: 0.984" (25.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 4.14W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.50°C/W @ 200 LFM
- Thermal Resistance @ Natural: 18.10°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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