HSB09-212115
CUI Devices
CUI Devices
HEAT SINK, BGA, 21 X 21 X 15 MM
$0.93
Available to order
Reference Price (USD)
1+
$0.93000
500+
$0.9207
1000+
$0.9114
1500+
$0.9021
2000+
$0.8928
2500+
$0.8835
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Experience top-tier cooling with CUI Devices's HSB09-212115 Heat Sinks, crafted for demanding environments. Featuring enhanced surface area and superior airflow, these heat sinks are perfect for data centers, automotive electronics, and power converters. Ensure your equipment runs smoothly contact us today to discuss your requirements and discover the ideal heat sink for your application.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.827" (21.00mm)
- Width: 0.827" (21.00mm)
- Diameter: -
- Fin Height: 0.591" (15.00mm)
- Power Dissipation @ Temperature Rise: 4.3W @ 75°C
- Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
- Thermal Resistance @ Natural: 17.39°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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