HSB07-202009
CUI Devices
CUI Devices
HEAT SINK, BGA, 20 X 20 X 9 MM
$0.58
Available to order
Reference Price (USD)
1+
$0.58140
500+
$0.575586
1000+
$0.569772
1500+
$0.563958
2000+
$0.558144
2500+
$0.55233
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Enhance your thermal regulation with HSB07-202009 Heat Sinks from CUI Devices, designed for reliability and efficiency. These heat sinks provide superior cooling for high-density electronics, renewable energy systems, and medical equipment. Let us help you find the right solution reach out today and receive expert support for all your thermal management needs.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.787" (20.00mm)
- Width: 0.787" (20.00mm)
- Diameter: -
- Fin Height: 0.354" (9.00mm)
- Power Dissipation @ Temperature Rise: 3.1W @ 75°C
- Thermal Resistance @ Forced Air Flow: 8.60°C/W @ 200 LFM
- Thermal Resistance @ Natural: 24.08°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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