HSB06-181810
CUI Devices
CUI Devices
HEAT SINK, BGA, 18 X 18 X 10 MM
$1.02
Available to order
Reference Price (USD)
1+
$1.02000
500+
$1.0098
1000+
$0.9996
1500+
$0.9894
2000+
$0.9792
2500+
$0.969
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
CUI Devices's HSB06-181810 Heat Sinks offer cutting-edge thermal solutions for modern technology. With exceptional heat transfer capabilities and rugged durability, they are perfect for industrial machinery, defense systems, and consumer gadgets. Elevate your cooling strategy contact us now for personalized recommendations and competitive pricing.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: BGA
- Attachment Method: Adhesive
- Shape: Square, Pin Fins
- Length: 0.709" (18.00mm)
- Width: 0.709" (18.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 3.2W @ 75°C
- Thermal Resistance @ Forced Air Flow: 18.80°C/W @ 200 LFM
- Thermal Resistance @ Natural: 23.68°C/W
- Material: Aluminum Alloy
- Material Finish: Black Anodized
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