GP3004SF-0.080-01-0918
Bergquist
Bergquist
BERGQUIST GAP PAD TGP 3004SF
$728.56
Available to order
Reference Price (USD)
1+
$728.56000
500+
$721.2744
1000+
$713.9888
1500+
$706.7032
2000+
$699.4176
2500+
$692.132
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Bergquist's GP3004SF-0.080-01-0918 Thermal Pads and Sheets offer unmatched thermal management for a wide range of electronic devices. With superior heat dissipation properties, these pads and sheets are ideal for use in data centers, medical equipment, and other high-performance applications. Trust in Bergquist's expertise to deliver products that meet your cooling needs. Submit your inquiry now and let us help you find the perfect solution.
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 457.20mm x 228.60mm
- Thickness: 0.0800" (2.032mm)
- Material: Non-Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: Fiberglass
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K
Related Products
3M (TC)
19.05MMOD-8MMID-25-8815
3M (TC)
3M 8810 9" X 36YD
Laird Technologies - Thermal Materials
A17156-18
t-Global Technology
TG-AH486-100-100-0.5-0
Laird Technologies - Thermal Materials
A16104-03
Laird Technologies - Thermal Materials
A17679-14
Laird Technologies - Thermal Materials
A17679-12
Laird Technologies - Thermal Materials
A14563-01
Laird Technologies - Thermal Materials
A17536-13
Leader Tech Inc.