GP3004SF-0.023-01-0918
Bergquist
Bergquist
BERGQUIST GAP PAD TGP 3004SF
$291.69
Available to order
Reference Price (USD)
1+
$291.69000
500+
$288.7731
1000+
$285.8562
1500+
$282.9393
2000+
$280.0224
2500+
$277.1055
Exquisite packaging
Discount
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Bergquist presents GP3004SF-0.023-01-0918 Thermal Pads and Sheets, the ultimate solution for effective heat dissipation in compact and high-performance devices. Featuring high thermal conductivity and electrical insulation, these products are widely used in consumer electronics, medical devices, and aerospace applications. Ensure your devices run cooler and last longer with our premium thermal management solutions. Request a sample or quote today!
Specifications
- Product Status: Active
- Usage: Thermally Conductive
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 457.20mm x 228.60mm
- Thickness: 0.0230" (0.584mm)
- Material: Non-Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: Fiberglass
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 3.0W/m-K