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CC9601062PSAC

Canfield Technologies
CC9601062PSAC Preview
Canfield Technologies
SAC 305 NO CLEAN FLUX 1 LB .062
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Specifications

  • Product Status: Active
  • Type: Solder Paste
  • Composition: Sn96.5Ag3Cu0.5 (96.5/3/0.5)
  • Diameter: -
  • Melting Point: 423 ~ 424°F (217 ~ 218°C)
  • Flux Type: Rosin Mildly Activated (RMA)
  • Wire Gauge: -
  • Mesh Type: -
  • Process: Lead Free
  • Form: Spool, 1 lb (454 g)
  • Shelf Life: -
  • Shelf Life Start: -
  • Storage/Refrigeration Temperature: -

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