BOND PLY 660P 11X12"
Bergquist
Bergquist
THERM PAD 304.8MMX279.4MM W/ADH
$0.00
Available to order
Reference Price (USD)
1+
$0.00000
500+
$0
1000+
$0
1500+
$0
2000+
$0
2500+
$0
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Bergquist's BOND PLY 660P 11X12" Thermal Pads and Sheets offer unmatched thermal management for a wide range of electronic devices. With superior heat dissipation properties, these pads and sheets are ideal for use in data centers, medical equipment, and other high-performance applications. Trust in Bergquist's expertise to deliver products that meet your cooling needs. Submit your inquiry now and let us help you find the perfect solution.
Specifications
- Product Status: Obsolete
- Usage: -
- Type: Sheet, Tape
- Shape: Rectangular
- Outline: 304.80mm x 279.40mm
- Thickness: 0.0080" (0.203mm)
- Material: Polyimide
- Adhesive: Adhesive - Both Sides
- Backing, Carrier: Polyimide
- Color: Brown
- Thermal Resistivity: 0.81°C/W
- Thermal Conductivity: 0.4W/m-K
Related Products
Laird Technologies - Thermal Materials
A16366-41
Laird Technologies - Thermal Materials
A15347-01
t-Global Technology
TG-A373F-15.1-11.5-0.3-1A
Laird Technologies - Thermal Materials
A10092-155
Laird Technologies - Thermal Materials
A15710-09
Laird Technologies - Thermal Materials
A16364-04
t-Global Technology
TG-A375S-300-300-2.0-0
Laird Technologies - Thermal Materials
A15344-02
Laird Technologies - Thermal Materials
A12626-01
Laird Technologies - Thermal Materials