ATS-H1-39-C2-R0
Advanced Thermal Solutions Inc.
Advanced Thermal Solutions Inc.
HEATSINK 57.9X60.96X5.84MM T766
$16.51
Available to order
Reference Price (USD)
1+
$17.60000
10+
$16.67100
25+
$15.74440
50+
$14.81860
100+
$13.89240
250+
$12.96624
500+
$12.73470
Exquisite packaging
Discount
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Upgrade your thermal management with Advanced Thermal Solutions Inc.'s ATS-H1-39-C2-R0 Heat Sinks, engineered for superior cooling efficiency. Featuring advanced fin designs and high-quality materials, these heat sinks ensure optimal thermal conductivity and longevity. Perfect for use in telecommunications, medical devices, and consumer electronics. Ready to enhance your system's performance? Submit your inquiry now and our team will assist you with the best thermal solutions.
Specifications
- Product Status: Active
- Type: Top Mount
- Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
- Attachment Method: Push Pin
- Shape: Rectangular, Fins
- Length: 2.280" (57.90mm)
- Width: 2.400" (60.96mm)
- Diameter: -
- Fin Height: 0.230" (5.84mm)
- Power Dissipation @ Temperature Rise: -
- Thermal Resistance @ Forced Air Flow: 18.94°C/W @ 100 LFM
- Thermal Resistance @ Natural: -
- Material: Aluminum
- Material Finish: Blue Anodized
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