AF200-313005
CUI Devices
CUI Devices
THERMAL INTERFACE MATERIAL, AF20
$15.13
Available to order
Reference Price (USD)
4+
$16.84750
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Choose AF200-313005 Thermal Pads and Sheets from CUI Devices for superior heat dissipation in demanding environments. These products are crafted to provide long-lasting thermal stability, ensuring your equipment operates at peak efficiency. Commonly used in servers, power supplies, and telecommunications hardware, our thermal solutions are trusted by professionals globally. Reach out to us for a consultation or to request a sample.
Specifications
- Product Status: Active
- Usage: -
- Type: Pad, Sheet
- Shape: Rectangular
- Outline: 31.00mm x 30.00mm
- Thickness: 0.0197" (0.500mm)
- Material: Non-Silicone
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: White
- Thermal Resistivity: -
- Thermal Conductivity: 2.0W/m-K
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Shiu Li Technology Co., Ltd.