A18444-09
Laird Technologies - Thermal Materials
Laird Technologies - Thermal Materials
TFLEX HD7.5,2.25 9X9IN,
$165.86
Available to order
Reference Price (USD)
1+
$165.86000
500+
$164.2014
1000+
$162.5428
1500+
$160.8842
2000+
$159.2256
2500+
$157.567
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Maximize your device's thermal performance with A18444-09 Thermal Pads and Sheets from Laird Technologies - Thermal Materials. These versatile products offer exceptional heat resistance and adaptability, making them suitable for CPUs, GPUs, and other heat-sensitive components. Whether for industrial or commercial use, our thermal pads and sheets deliver consistent results. Contact us now to discuss your specific requirements and place your order.
Specifications
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 228.60mm x 228.60mm
- Thickness: 0.0900" (2.286mm)
- Material: Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 7.5W/m-K
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