A18213-20
Laird Technologies - Thermal Materials
Laird Technologies - Thermal Materials
TFLEX SF10,5.00 229X229MM
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Maximize your device's thermal performance with A18213-20 Thermal Pads and Sheets from Laird Technologies - Thermal Materials. These versatile products offer exceptional heat resistance and adaptability, making them suitable for CPUs, GPUs, and other heat-sensitive components. Whether for industrial or commercial use, our thermal pads and sheets deliver consistent results. Contact us now to discuss your specific requirements and place your order.
Specifications
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 229.00mm x 229.00mm
- Thickness: 0.197" (5.00mm)
- Material: Non-Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 10W/m-K
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