A18212-09
Laird Technologies - Thermal Materials
Laird Technologies - Thermal Materials
TFLEX SF10,2.25 457X457MM
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Maximize your device's thermal performance with A18212-09 Thermal Pads and Sheets from Laird Technologies - Thermal Materials. These versatile products offer exceptional heat resistance and adaptability, making them suitable for CPUs, GPUs, and other heat-sensitive components. Whether for industrial or commercial use, our thermal pads and sheets deliver consistent results. Contact us now to discuss your specific requirements and place your order.
Specifications
- Product Status: Obsolete
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 457.00mm x 457.00mm
- Thickness: 0.0886" (2.250mm)
- Material: Non-Silicone, Ceramic Filled
- Adhesive: -
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 10W/m-K
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