A17876-17
Laird Technologies - Thermal Materials
Laird Technologies - Thermal Materials
TFLEX HD3170TG 17.5X18"
$566.49
Available to order
Reference Price (USD)
1+
$464.46000
Exquisite packaging
Discount
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Maximize your device's thermal performance with A17876-17 Thermal Pads and Sheets from Laird Technologies - Thermal Materials. These versatile products offer exceptional heat resistance and adaptability, making them suitable for CPUs, GPUs, and other heat-sensitive components. Whether for industrial or commercial use, our thermal pads and sheets deliver consistent results. Contact us now to discuss your specific requirements and place your order.
Specifications
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Rectangular
- Outline: 457.20mm x 444.50mm
- Thickness: 0.170" (4.32mm)
- Material: Silicone, Ceramic Filled
- Adhesive: Tacky - Both Sides
- Backing, Carrier: -
- Color: Pink
- Thermal Resistivity: -
- Thermal Conductivity: 2.7W/m-K