A17819-07
Laird Technologies - Thermal Materials
Laird Technologies - Thermal Materials
TFLEX HD91750,DC1
$833.33
Available to order
Reference Price (USD)
1+
$723.35000
Exquisite packaging
Discount
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Laird Technologies - Thermal Materials's A17819-07 Thermal Pads and Sheets offer unmatched thermal management for a wide range of electronic devices. With superior heat dissipation properties, these pads and sheets are ideal for use in data centers, medical equipment, and other high-performance applications. Trust in Laird Technologies - Thermal Materials's expertise to deliver products that meet your cooling needs. Submit your inquiry now and let us help you find the perfect solution.
Specifications
- Product Status: Active
- Usage: -
- Type: Gap Filler Pad, Sheet
- Shape: Square
- Outline: 457.20mm x 457.20mm
- Thickness: 0.0689" (1.750mm)
- Material: Silicone, Ceramic Filled
- Adhesive: Tacky - One Side
- Backing, Carrier: -
- Color: Gray
- Thermal Resistivity: -
- Thermal Conductivity: 7.5W/m-K
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