514-87-360M19-001148
Preci-Dip
Preci-Dip
CONN SOCKET BGA 360POS GOLD
$32.88
Available to order
Reference Price (USD)
21+
$71.60571
Exquisite packaging
Discount
TT / Paypal / Credit Card / Western Union / Money Gram
Upgrade your electronic projects with 514-87-360M19-001148 Preci-Dip sockets, ideal for ICs and transistors. Featuring robust materials and precision engineering, these sockets offer excellent conductivity and long-term reliability. Suitable for applications in telecommunications, medical devices, and aerospace, they ensure seamless connectivity. Interested in learning more? Reach out to our team for personalized assistance!
Specifications
- Product Status: Active
- Type: BGA
- Number of Positions or Pins (Grid): 360 (19 x 19)
- Pitch - Mating: 0.100" (2.54mm)
- Contact Finish - Mating: Gold
- Contact Finish Thickness - Mating: Flash
- Contact Material - Mating: Beryllium Copper
- Mounting Type: Surface Mount
- Features: Open Frame
- Termination: Solder
- Pitch - Post: 0.100" (2.54mm)
- Contact Finish - Post: Tin
- Contact Finish Thickness - Post: -
- Contact Material - Post: Brass
- Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
- Operating Temperature: -55°C ~ 125°C
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Preci-Dip