374324B00035G
Aavid, Thermal Division of Boyd Corporation
Aavid, Thermal Division of Boyd Corporation
HEATSINK BGA W/ADHESIVE TAPE
$2.54
Available to order
Reference Price (USD)
1+
$6.45000
10+
$6.28400
25+
$5.95280
50+
$5.62200
100+
$5.29120
250+
$4.96052
500+
$4.62980
1,000+
$4.54713
Exquisite packaging
Discount
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Keep your systems cool and efficient with Aavid, Thermal Division of Boyd Corporation's 374324B00035G Heat Sinks, built for high-performance applications. These heat sinks feature optimized thermal resistance and sleek designs, suitable for robotics, electric vehicles, and telecommunications. Ready to improve your thermal management? Submit your request today and benefit from our industry-leading expertise.
Specifications
- Product Status: Active
- Type: Board Level
- Package Cooled: BGA, FPGA
- Attachment Method: Thermal Tape, Adhesive (Included)
- Shape: Square, Pin Fins
- Length: 1.063" (27.00mm)
- Width: 1.063" (27.00mm)
- Diameter: -
- Fin Height: 0.394" (10.00mm)
- Power Dissipation @ Temperature Rise: 3.0W @ 90°C
- Thermal Resistance @ Forced Air Flow: 9.30°C/W @ 200 LFM
- Thermal Resistance @ Natural: 30.60°C/W
- Material: Aluminum
- Material Finish: Black Anodized
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